Search results for "Interpenetrating polymer network"
showing 5 items of 5 documents
Bond strength of a new Kevlar fiber-reinforced composite post with semi-interpenetrating polymer network (IPN) matrix
2019
Background This study aimed to evaluate the bond strength and the penetration depth of two adhesive systems to a new experimental semi-IPN fiber post versus a commercial post. Material and Methods Experimental Kevlar fiber (KF) and control everStick®POST (ES) posts (n=20/ group) with a diameter of 1.5 mm were used, 10 posts coated with StickResin (SR) and the other 10 posts coated with Scotch bond multipurpose (SBMP) adhesives. Composite resin buildup was performed over each post, using a cylindrical plastic mold (10 mm × 6 mm). Four discs of 2 mm thickness were prepared from each post/composite buildup and underwent pushout bond strength test at a crosshead speed of 0.5 mm/min accompanied …
Effect of Poly(Titanium Oxide) on the Viscoelastic and Thermophysical Properties of Interpenetrating Polymer Networks
2021
The authors thank V. Serga for many useful discussions. The research was (partly) performed in the Institute of Solid State Physics, University of Latvia ISSP UL. ISSP UL as the Center of Excellence is supported through the Framework Program for European universities Union Horizon 2020, H2020-WIDESPREAD-01–2016–2017-Teaming Phase 2 under Grant Agreement No. 739508, CAMART2 project.
Charge dissipation in e-beam lithography with Novolak-based conducting polymer films
2008
Charging of common resist materials during electron beam (e-beam) writing leads to deflection of the electron beam path, which can result in significant pattern displacement. Here we report a new conducting polymer to eliminate charging. A common approach is to place the conducting layer underneath the e-beam resist layer. Conductivity equal or greater than 10(-4) S cm(-1) has been reported to prevent pattern displacement. Some other properties such as a flat surface layer, chemical inertness and insolubility in both the top resist solvent and the developer are also necessary. The way to achieve all these properties consisted in synthesizing a conducting polymer inside an insulating polymer…
Patterning of Conducting Polymers Using UV Lithography: The in-Situ Polymerization Approach
2012
We report on the in-situ polymerization of 3T with Cu(ClO4)2 inside several host polymers such as Novolak-based negative-tone photoresist, polystyrene (PS), poly(4-vinylphenol) (P4VP), poly(methyl methacrylate) (PMMA), and poly(4-vinylphenol)-co-(methyl methacrylate) (P4VP-co-MMA) to form an interpenetrating polymer network (IPN). Conducting IPN films in the order of 10–4–150 S/cm are obtained depending on the specific IPN composition. Moreover, the convenience of this synthetic approach has been demonstrated using a commercially available negative-tone photoresist based on Novolak as a host polymer. Novolak photoresist was properly formulated with 3T and Cu(ClO4)2 to preserve as far as pos…
Novel patternable and conducting metal-polymer nanocomposites: a step towards advanced mutlifunctional materials
2013
In this work, we present a novel patternable conducting nanocomposite containing gold nanoparticles. Here, the in-situ polymerization of 3T is carried out using HAuCl 4 as oxidizing agent inside PMMA as host matrix. During the bake step, the gold salt is also reduced from Au(III) to Au(0) generating Au nanoparticles in the interpenetrating polymer network (IPN) system. We found that this novel multifunctional resist shows electrical conductivity and plasmonic properties as well as potential patterning capability provided by the host matrix. The resulting nanocomposite has been investigated by TEM and UV-Vis spectroscopy. Electrical characterization was also conducted for different concentra…